THE MEANS TO BUILD
830-point solderless breadboard

PX / MB830

830-point solderless breadboard

More wiring space for multi-module prototypes and classroom circuit labs.

400 FCFA

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830-contact variant. Verify split power rails before wiring. Low-voltage signal circuits only.

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Technical specifications

Manufacturer
Ruinuosi (Shenzhen) Technology Co., Ltd.
Manufacturer reference
106004620604
Contacts
830
Compatibility
830-contact variant. Verify split power rails before wiring. Low-voltage signal circuits only.

Integration notes

Start with a low-voltage bench setup. Confirm connector orientation, header population and supply requirements before making connections. Keep a wiring diagram and change one connection at a time.

Specifications refer to the stated manufacturer reference. Check pin assignments and your application’s operating conditions before assembly.